Gold sputtering targets are critically essential for a wide range of functions across diverse fields. Typically, gold sputtering targets are available in several purities, ranging from 99.9% to 99.999% (5N) or even higher, impacting the final film's qualities. While pure gold is common, many sputtering materials incorporate alloying elements, such as Cu, Argentum, or platinum, to modify the resulting film's electrical conductance, mechanical durability, or adhesion. Common compositions used for sputtering source backing include molybdenum (Mo) and tungsten (Wolfram) to improve thermal conductivity and prevent diffusion during the sputtering process. Applications span microchips for connectors and interconnects, decorative layers on jewelry and consumer products, medical devices requiring biocompatible interfaces, and research in areas like plasmonics and metamaterials. Ultimately, the material selection is dictated by the precise film characteristics desired in the final product.
Understanding Gold Sputtering Target Price Overview: Significant Factors & Potential Expenses
Determining the price of a gold sputtering target isn't straightforward; several elements contribute to the final amount. The quality of the gold, typically expressed in percentages (e.g., 99.99% or 3N gold), is a primary driver. Higher quality means a greater expense due to the inherent value of the precious metal. Target configuration and dimension also play a crucial function; larger targets, unsurprisingly, will typically be more costly. Manufacturing techniques, including the amount of mechanical polishing, influence production costs. Furthermore, the supplier and their operating expenses can change considerably. Expect to find target costs extending from hundreds to several thousand units depending on these combined factors. For minor quantities or custom-made targets, setup times and extra costs may apply important.
Sputter Coating with Gold Objectives : A Comprehensive Review
Sputter plating using gold aims has become an increasingly popular technique across numerous areas, particularly in microelectronics, optics, and healthcare engineering. This process leverages a plasma release to eject gold particles from a solid gold source, which then condense onto a substrate, forming a thin layer. The resultant gold coating imparts desirable qualities such as enhanced electrical conductance, improved luster, or a barrier to corrosion. Careful control of parameters like pressure, force, and substrate temperature is crucial to achieving the desired breadth and consistency of the gold coating. Various procedures exist to optimize the operation, often involving pre-cleaning the substrate and utilizing reactive gases to modify the film’s structure. Further, the choice of backing material significantly affects the adhesion get more info and overall performance of the gold film.
Au Sputtering Target Specifications & Technical Data
Selecting the appropriate or sputtering target necessitates careful review of its specifications and associated technical data. Target purity, generally expressed as a percentage, directly impacts the film’s properties and suitability for applications such as microelectronics, decorative coatings, and sensors. Density, measured in grams per cubic centimeter, influences coating uniformity and adhesion. A typical gold target might exhibit a density between 19.3 and 19.6 g/cm3. Thickness, representing the target material’s depth, is critical for controlling deposition rates. Grain size, observable through microscopy, affects surface roughness and film performance. We routinely provide data sheets including X-ray diffraction (XRD) analyses, composition reports (using Inductively Coupled Plasma Mass Spectrometry – ICP-MS), and electrical resistivity measurements to ensure traceability and quality assurance. Moreover, the target's form – , custom – and its orientation, can influence process efficiency. It’s important to verify these details before procurement.
Optimizing Gold Sputtering: Techniques and Best Practices
Achieving consistent gold sputtering results often requires careful attention to several key factors. Beyond simply running the sputter process, optimization involves precise control over settings such as working gas, substrate temperature, and sputtering voltage. A frequent challenge arises from lowering substrate contamination; techniques like pre-sputtering the target to remove surface oxides, employing a shutter to prevent initial gas cloud impact on the substrate, and meticulous cleaning of the substrate itself are crucial. Furthermore, the choice of background gas, typically argon, and its cleanliness, drastically affects film adhesion. Sophisticated approaches may include pulsed DC sputtering for improved step coverage, or utilizing reactive sputtering with trace amounts of oxygen to modify the gold film’s properties. Ultimately, frequent monitoring of film thickness and morphology using techniques like profilometry and SEM is essential for continuous optimization.
Understanding Gold Sputtering: Process & Equipment
Gold Au sputtering, a pivotal vital thin film deposition layering technique, relies on bombarding a gold Au target with ions, typically argon Ar, to release gold gold atoms that subsequently deposit onto a substrate. The process method fundamentally involves a vacuum void chamber where the target and substrate are positioned. Crucially, the equipment apparatus includes a vacuum vacuum pump to establish a high vacuum, a radio frequency radio frequency or direct current DC power power supply to generate plasma plasma, and a sputtering launching system composed of electrodes and gas delivery gas flow components. The substrate foundation, often silicon Si or glass, must be meticulously meticulously cleaned to ensure proper adhesion bonding. Advanced systems systems may incorporate rotating stages turntables for uniform consistent film thickness across the substrate substrate and precise temperature temperature control.